Hewlett Packard | HPE - 贷款资金





贷款资金 更改 日
3D Systems USD 86.79M 9.12M 2026-03
Advanced Micro Devices USD 2.35B 2M 2026-03
Amazon USD 119.07B 53.43B 2026-03
Amphenol USD 16.64B 2.07B 2026-03
Apple USD 74.4B 2.28B 2026-03
AT & S Austria Technologie & Systemtechnik AG EUR 1.26B 346.24M 2026-03
Barco NV EUR 41.06M 3.8M 2025-06
Broadcom USD 62.66B 1.15B 2026-03
CDW USD 4.64B 12.8M 2026-03
Ciena USD 1.52B 5.2M 2026-03
Cisco Systems USD 19.37B 2B 2026-03
Codan AUD 143.25M 9.95M 2025-12
Cognizant Technology Solutions USD 535M 8M 2026-03
CommScope USD 7.26B 1.98B 2025-12
Corning USD 7.72B 88M 2026-03
Cx Technology TWD 638.63M 16.13M 2025-12
Datatec USD 77.56M 12.17M 2026-06
Dell Technologies USD 23.61B 98M 2026-03
Dicker Data AUD 271.09M 48.13M 2025-12
Extreme Networks USD 149.22M 4.84M 2026-03
F5 Networks USD 0 0 2024-12
Fingerprint Cards SEK 900K 900K 2025-06
Fujitsu JPY 90.3B 4.24B 2026-03
Gold Circuit Elect TWD 9.27B 2.67B 2026-03
Hewlett Packard USD 18.24B 532M 2026-03
Hitachi JPY 539.75B 1.11B 2026-03
HP USD 8.86B 18M 2026-03
IBM USD 57.71B 2.87B 2026-03
Intel USD 43.03B 1.06B 2026-03
Jabil Circuit USD 2.88B 497M 2026-03
Keysight Technologies USD 1.83B 702M 2026-03
Lenovo USD 3.86B 566.95M 2026-03
Logitech International USD 0 0 2024-12
Micron Technology USD 3.05B 6.51B 2026-03
Motorola Solutions Msi USD 8.42B 2M 2026-03
NetApp USD 2.49B 1000K 2026-03
Nvidia USD 7.47B 1000K 2026-03
Oracle USD 122.34B 8.09B 2026-03
Positivo Tecnologia BRL 787.06M 44.12M 2026-03
Prime Electronics TWD 59.61M 13.89M 2026-03
Qualcomm USD 14.77B 45M 2026-03
Samsung Electronics KRW 25.24T 8.57T 2025-12
Scientech TWD 70.61M 4.33M 2025-12
Seagate Technology USD 3.47B 36M 2026-03
Sensata Technologies USD 2.83B 18.1M 2026-03
Super Micro Computer USD 4.68B 972K 2025-12
SYNNEX USD 3.59B 1.16M 2026-03
TE Connectivity USD 5.53B 23M 2026-06
Western Digital USD 2.43B 28M 2025-12
Xerox USD 3.48B 785M 2025-06
Xiaomi CNY 25.01B 2.09B 2026-03